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Vacuum reflow

Written By: Michael Macpherson Vacuum Reflow Soldering

Did you ever wonder for a second how your computer or phone works? It begins with little microchips and circuits being soldered together. Soldering performs something like a special glue that ensures these parts remain in their correct position. Soldering, on the other hand is a technique that has been used typically in the past for building these types of connections which while functional can have its own mess to make and even some precarious toput everything together. Enter vacuum reflow technology - a process that aims to reimagine traditional methods by achieving the same results, but utilizing innovation as well as additional safety precautions.

    Advantages of Vacuum Reflow

    Vacuum reflow technology has one important benefit over atmospheric soldering in that it can generate the best quality solder joints. Rather than melting the solder with an open flame or hot plate like traditional methods, vacuum reflow uses a controlled environment to deliver clean and reliable solder joints. This concept can also prevent components from getting too hot and causing damage, which apart being expensive to repair it takes more time.

    This also represent another advantage of vacuum reflow - it has less exploits solder paste. Through the use of a vacuum, excess solder is removed which leads to less waste and mess compared to how things are done traditionally! This helps save costs and also prevents a longer lasting footprint because of lesser paper use. Also, since the solder is reflowed in a vacuum environment, there would be very little oxidation and hence stronger and long lasting joints.


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