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Convection reflow soldering

Convection Reflow Soldering: The revolutionary way of.

Convection reflow soldering is a technique that was advanced of electronics components onto a printed circuit board (PCB). It will often be carried out in an environment that has been closed using convection ovens, infrared heaters, or hot plates. This SHENZHEN GRANDSEED TECHNOLOGY DEVELOPMENT technique has advantages that are several other soldering methods like wave soldering, hand soldering, and selective soldering. 

Features of Convection Reflow Soldering

Firstly, convection reflow soldering is faster than many other soldering that is conventional. The SHENZHEN GRANDSEED TECHNOLOGY DEVELOPMENT process involves heating the PCB and solder paste to a temperature that is specific resulting in the paste to melt and flow onto the automatic smd soldering machine components. This can be achieved within a few minutes, unlike the entire hours required for hand soldering. Secondly, convection reflow soldering is more consistent and accurate than many other soldering methods. The solder joints could be produced with a high quality and reliability than with other methods with precise temperature control. This minimizes the risk of defects, such as cold joints, bad wetting, and soldering that is incomplete.

Why choose SHENZHEN GRANDSEED TECHNOLOGY DEVELOPMENT Convection reflow soldering?

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