Uyisebenzisa njani i-oven yokubuyisela

Umatshini we-reflow soldering usetyenziswa kakhulu kwinkqubo ye-SMT. Kwinkqubo ye-SMT, umsebenzi ophambili womatshini wokuphinda uphinde ubeke ibhodi ye-PCB kunye namacandelo kumkhondo womatshini wokuphinda udibanise. Emva kokufudumeza, ukugcinwa kobushushu, ukuwelda, ukupholisa, njl. Kwinkqubo, intlama ye-solder iyatshintshwa ukusuka kwi-paste ukuya kulwelo ngokusebenzisa ubushushu obuphezulu, kwaye emva koko ipholile ibe yinto eqinile, ukuze kuqondwe umsebenzi we-soldering chip electronic components kunye neebhodi ze-PCB. Owona msebenzi uphambili womatshini wokuthambisa we-reflow kuku-weld ibhodi yePCB kunye namacandelo, anemisebenzi yokusebenza kakuhle kwemveliso, iziphene ezincinci ze-welding kunye nokusebenza okuzinzileyo.

Iimeko zokusebenzisa umatshini wokuphinda udibanise

1, Khetha imathiriyeli efanelekileyo kunye nendlela yokuphinda ujikeleze i-solder.

Ngenxa yokuba ukukhethwa kwezinto eziphathekayo kubaluleke kakhulu, kufuneka kunconywe ngumbutho ogunyazisiweyo, okanye kufuneka kuqinisekiswe ukuba kukhuselekile emva kokuyisebenzisa ngaphambili. Kukho izinto ezininzi ezinokuthi ziqwalaselwe xa ukhetha izinto: ezifana nohlobo lwesixhobo sokuthengisa, uhlobo lwebhodi yesekethe, kunye nemeko yokwaleka komhlaba. Ngokubhekiselele kwindlela echanekileyo, kuyimfuneko ukuphumeza ngokweemeko zakho zokwenyani, khumbula ukuba ungalingisi ngokupheleleyo abanye, ngenxa yeentlobo ezahlukeneyo zamacandelo kunye nokuhanjiswa kunye nobuninzi bamacandelo ahlukeneyo ebhodini, ezi kufuneka ziqwalaselwe ngononophelo. wafunda.

2, Misela indlela yenkqubo kunye neemeko.

Oku kukuphuhlisa iisampulu ze-lead-free soldering. Emva kokuba izinto ezikhethiweyo zikhethiweyo kwaye indlela inqunywe, uvavanyo lwenkqubo ye-welding inokuqaliswa, ngoko ayikwazi ukuhoywa.

Amanyathelo okusebenza komatshini wokuphinda uqukunjelwe nge-solder:

I-1, Jonga ukuba kukho nayiphi na i-debris kumatshini we-reflow soldering, yigcine icocekile, kwaye emva koko uyivule emva kokuqinisekisa ukhuseleko, kwaye ukhethe inkqubo yokuvelisa ukuvula ukusetha ubushushu.

I-2, Ekubeni ububanzi bomzila wesikhokelo somatshini wokuphinda uhlaziywe kufuneka ulungelelaniswe ngokobubanzi bePCB, ukuthuthwa komoya, ukuthuthwa kwebhanti ye-mesh kunye nefeni yokupholisa kufuneka ivulwe.

3,Ulawulo lobushushu bomatshini we-Granseed reflow unelona khokelo liphezulu (245 ± 5) ℃, iqondo lobushushu leemveliso ezingenalothe lilawulwa ku-(255±5)℃, kunye nobushushu bangaphambili yi-80℃~110℃. Ngokweeparamitha ezinikwe yinkqubo yokuvelisa i-welding, iisetingi zeparameter yekhompyutheni yomshini wokuthungatha i-reflow zilawulwa ngokungqongqo kwaye zilawulwa ngokungqongqo, kwaye iiparitha zomatshini wokuthengisa i-reflow zirekhodwa ngexesha lemihla ngemihla.

4,Vula iiswitshi zendawo yobushushu ngokulandelelana, kwaye xa iqondo lobushushu linyuka ukuya kwiqondo lobushushu elibekiweyo, unokuqalisa ukudlula, iPCB, ibhodi, kwaye ubeke ingqalelo kwicala lebhodi. Qinisekisa ukuba umgama phakathi kweebhodi ezimbini ezilandelelanayo zebhanti yokuhambisa ayikho ngaphantsi kwe-10mm.

I-5, Lungisa ububanzi bebhanti yokuhambisa umatshini wokuphinda uphinde udibanise kwindawo ehambelanayo, ububanzi kunye nobubanzi bebhanti yokuhambisa iyahambelana nebhodi yesiphaluka, kwaye ukhangele inombolo yebhetshi yezinto eziza kucutshungulwa kunye neemfuno zobuchwepheshe ezinxulumene nazo.

I-6, Umatshini omncinci wokuphinda uthengise i-reflow akufuneki ube mde kakhulu kwaye ubushushu buphezulu kakhulu ukuba bubangele ubhedu kunye neplatinam; iintambo ze-solder kufuneka zibe zihamba kakuhle kwaye zikhanyise, kwaye ibhodi yesiphaluka kufuneka ifakwe kwi-tinned kuzo zonke iipads; isekethe engathengiswanga kakuhle kufuneka ihlaziywe, kwaye i-reflow yesibini kufuneka ipholiswe emva kokupholisa.

I-7, Ukunxiba iiglavu ukufikelela kwi-PCB ethengisiweyo, chukumisa kuphela umda we-PCB, isampuli ze-10 ngeyure, khangela imeko embi, kwaye urekhode idatha. Kwinkqubo yokuvelisa, ukuba kufunyenwe ukuba iiparitha azikwazi ukuhlangabezana neemfuno zokuvelisa, iiparitha azikwazi ukulungiswa ngokwazo, kwaye uchwepheshe kufuneka aziswe ngokukhawuleza.

8,Linganisa iqondo lobushushu: Faka abenzi boluvo kwisokethi yokufumana umvavanyi ngokulandelayo, vula isitshixo sombane somvavanyi, faka umvavanyi kwi-reflow soldering kwaye uphinde ujikeleze ngebhodi yePCB endala, yikhuphe kwaye usebenzise ikhompyuter. ukufunda umvavanyi eGranseed. Idatha yokushisa erekhodiweyo ngexesha lenkqubo ye-soldering ye-reflow yidatha ye-original ye-curve yeqondo lokushisa lomshini wokuthungatha.

9, Hlela iibhodi ezidityanisiweyo ngokwenombolo yomyalelo, igama, njl., ukuthintela ukuxubana okubi.

Imigqaliselo yokusebenza kunye nokusetyenziswa komatshini wokuphinda ubuyele

I-1, Uluhlu lokulawula ubushushu luhambelana neenkcukacha zenkcazo, kwaye ukuchaneka kokulawula kungaphakathi kwe-± 2.0 ° C;

I-2, Ulawulo lwesantya ludibana neenkcukacha zencwadana, kwaye ukuchaneka kulawulwa ngaphakathi kwe-± 0.2m / min;

I-3, Umahluko weqondo lokushisa elisecaleni lentshukumo ye-substrate (≤150mm isithuba) ingaphakathi ± 10.0℃;

I-4,Ukubonakala kwe-heater kugqityiwe kwaye uxhumano lombane luthembekile. Ifeni yomoya oshushu iqhuba kakuhle kwaye yenza ingxolo;

I-5, iileyili zesikhokelo zinokuhlengahlengiswa ngokukhululekileyo kwaye zihlale zihambelana. Ububanzi obusebenzayo be-substrate yokuhambisa ihambelana neenkcukacha

6,Inkqubo yokusebenza isebenza ngokuqhelekileyo, inkangeleko yezixhobo kunye neemitha ilungile, isalathiso sichanekile, kwaye ufundo lutsala amehlo, ngaphakathi kwexesha losetyenziso olufanelekileyo;

7,Izixhobo zombane zigqityiwe, imibhobho icwangciswe ngocwangco, kwaye ukusebenza kubuthathaka kwaye kuthembekile;

8, Ukugcinwa rhoqo ngaphakathi nangaphandle kwesixhobo, ingubo emthubi, igrisi, ukuhlolwa rhoqo kocingo lokufudumeza ukunqanda ukuguga kunye nokuvuza;

9, Ungalichukumisi ibhanti le-mesh ngexesha lokusebenza, kwaye ungavumeli amanzi okanye amabala e-oyile awele eziko ukukhusela ukutsha;

I-10, Ukungena komoya kufuneka kuqinisekiswe ngexesha lomsebenzi we-welding ukuthintela ukungcoliseka komoya, kwaye abaqhubi kufuneka banxibe iimpahla zokusebenza kunye nemaski;